PURPOSE: To seal an optical semiconductor element without using a framework, a mold, etc., by forming part of a board in a cylindrical part, mounting the element in the part, and sealing the element with light transmission resin.
CONSTITUTION: A pair of wings 2, 2 of a board 1 are so bent at upside, then inside as to form in an L shape to form a cylindrical, part 7, and a submount 4 and a laser chip 5 are disposed therein. Light transmission resin 8 filled in the part 7 is formed, for example, of epoxy resin to seal the submount 4 and the chip 5. Or, the chip 5 or particularly a part covering its light emitting end face may coated with silicone or heat resistance resin such as epoxy resin, and then sealed with epoxy resin. Thus, the profile of the sealing light transmission resin can be specified by utilizing the surface tension of the light transmission resin itself with the cylindrical part. Accordingly, the element can be sealed with the light transmission resin without using a framework, a mold, etc.
TSUBOI KUNIO
IMAI YUJI
