Title:
OPTICAL WAVEGUIDE MODULE
Document Type and Number:
Japanese Patent JPH04216504
Kind Code:
A
Abstract:
PURPOSE:To relieve the requirement for the conditions on a service temp. by fixing an optical waveguide chip to a pedestal and fixing the pedestal via a buffer material into a housing. CONSTITUTION:The optical waveguide chip 2 consisting of LiNbO3 is fixed to the pedestal 4 consisting of a stainless steel. The pedestal 4 is then fixed into the housing 8 consisting of copal via the buffer material 6 which can be repetitively plastically deformed. The distortion occurring in the difference between the coefft. of linear thermal expansion of the optical waveguide chip 2 and the pedestal 4 and the coefft. of linear thermal expansion of the housing 8 is, therefore, absorbed in the buffer material 6 even if a temp. change is applied. Then, the possibility of curving of the optical waveguide chip 2 is eliminated.
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Inventors:
IWAMA TAKEO
Application Number:
JP41100390A
Publication Date:
August 06, 1992
Filing Date:
December 17, 1990
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
G02B6/122; G02B6/12; (IPC1-7): G02B6/12
Attorney, Agent or Firm:
Akira Matsumoto