Title:
ORGANIC COPPER COMPOUND AND MIXTURE SOLUTION CONTAINING THE COMPOUND AND THIN COPPER FILM MADE BY USING THE SAME
Document Type and Number:
Japanese Patent JP2002161069
Kind Code:
A
Abstract:
To provide an organic copper compound which is hardly decomposed in a stored state, before formed into a film, has a long life, gives a high film- forming speed, can efficiently be decomposed on a substrate, has a high evaporation property, and has excellent adhesivity to a ground film.
This organic copper compound represented by formula (1) (R is an unsaturated hydrocarbon compound) is obtained by coordinating 1,3- dihydroxy-1,3-propanedione and an unsaturated hydrocarbon compound on monovalent copper.
More Like This:
Inventors:
SAI ATSUSHI
OGI KATSUMI
OGI KATSUMI
Application Number:
JP2000302406A
Publication Date:
June 04, 2002
Filing Date:
October 02, 2000
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C07C55/08; C07C11/02; C07C11/22; C07F1/08; C07F7/08; C07F7/18; C23C16/18; H01L21/28; H01L21/285; (IPC1-7): C07C55/08; C07C11/02; C07C11/22; C07F7/08; C07F7/18; C23C16/18; H01L21/285
Attorney, Agent or Firm:
Masayoshi Suda