Title:
有機膜材料、これを用いた有機膜形成方法及びパターン形成方法
Document Type and Number:
Japanese Patent JP5925721
Kind Code:
B2
Abstract:
The invention provides an organic film composition comprises (A) a heat-decomposable polymer, (B) an organic solvent, and (C) an aromatic ring containing resin, with the weight reduction rate of (A) the heat-decomposable polymer from 30° C. to 250° C. being 40% or more by mass. There can be provided an organic film composition having not only a high dry etching resistance but also an excellent filling-up or flattening characteristics.
Inventors:
Takeshi Watanabe
Seiichiro Tachibana
Toshihiko Fujii
Kazumi Noda
Shunji Yano
Tsuyoshi Kanao
Seiichiro Tachibana
Toshihiko Fujii
Kazumi Noda
Shunji Yano
Tsuyoshi Kanao
Application Number:
JP2013062179A
Publication Date:
May 25, 2016
Filing Date:
March 25, 2013
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L101/02; C08K5/13; C08L59/00; C08L61/06; G03F7/11; G03F7/26; G03F7/40; H01L21/027
Domestic Patent References:
| JP2012077295A | ||||
| JP2011150023A | ||||
| JP2010064904A | ||||
| JP2003119281A |
Foreign References:
| WO2008069047A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya