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Title:
ORGANIC-INORGANIC COMPOSITE AND ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2004281785
Kind Code:
A
Abstract:

To provide a low-permittivity material whose flexibility is high.

The organic-inorganic composite contains a crosslinking structure by metal-oxygen bonding and a carbon atom that is covalently-bonded to the crosslinking structure, and has a continuous pore structure where voids are continuously connected.


Inventors:
SUGIMOTO TOSHIYA
MIYAMA TOSHIHITO
NOMURA SHIGEKI
Application Number:
JP2003072237A
Publication Date:
October 07, 2004
Filing Date:
March 17, 2003
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G79/00; C08G77/48; H01L21/312; H01L21/768; H01L23/522; (IPC1-7): H01L21/312; H01L21/768