Title:
静電塗布用有機薄膜素子封止剤、樹脂保護膜、電子デバイス、及び、電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP6391491
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition for electrostatic application that allows a uniform thin film to be efficiently formed under atmospheric pressure, and can suppressing the generation of outgas, and provide a resin protection film, an electronic device, and a method for producing the electronic device by use of the curable resin composition for electrostatic application.SOLUTION: A curable resin composition for electrostatic application comprises a curable compound that has a boiling point of less than 420°C and/or a molecular weight of less than 340, and is liquid at 25°C, and a polymerization initiator and/or thermosetting agent.SELECTED DRAWING: None
Inventors:
Nanasato Tokushige
Aida Tetsuya
Katsunori Nishide
Aida Tetsuya
Katsunori Nishide
Application Number:
JP2015026740A
Publication Date:
September 19, 2018
Filing Date:
February 13, 2015
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H05B33/04; B05D1/04; C08F16/12; C08G59/22; C08G65/18; C09D4/00; C09D163/00; H01L51/50; H05B33/10
Domestic Patent References:
| JP8501723A | ||||
| JP2012190612A | ||||
| JP2004195417A | ||||
| JP2000508008A |
Attorney, Agent or Firm:
Atomi International Patent Office