Title:
有機金属錯体及びその製造方法
Document Type and Number:
Japanese Patent JP5425573
Kind Code:
B2
Abstract:
An organometallic complex [Cu2(pyridine-3,5-dicarboxylate)2]n is provided by bonding a plurality of Cu2(pyridine-3,5-dicarboxylate)2 repeating units to each other. The organometallic complex can be obtained by the steps of dissolving copper acetate monohydrate or anhydrate and pyridine-3,5-dicarboxylic acid in a solvent, heating the solution at 50° C. to 140° C. for 24 to 168 hours to generate a reaction product, and then removing a guest molecule from the reaction product.
Inventors:
Hiroshi Sakai
Kanoya
Terumi Furuta
Hikaru Hosoe
Kanoya
Terumi Furuta
Hikaru Hosoe
Application Number:
JP2009213416A
Publication Date:
February 26, 2014
Filing Date:
September 15, 2009
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
C08G79/00; C07F1/08
Domestic Patent References:
| JP2010180199A | ||||
| JP2009035493A | ||||
| JP2007277106A | ||||
| JP2000202283A | ||||
| JP2008184533A |
Other References:
Lu, Jack Y.; Babb, Amy M.,A Simultaneous Reduction, Substitution, and Self-Assembly Reaction under Hydrothermal Conditions Afforded the First Diiodopyridine Copper(I) Coordination Polymer,Inorganic Chemistry,米国,2002年 3月25日,Vol.41 No.6,1339-1341
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Shuji Ouchi
Toshiyuki Miyadera
Shuji Ouchi