有機金属化合物 - Rohm and Haas Electronic Materials, L.L.C.

Title:

有機金属化合物

Document Type and Number:

Japanese Patent JP5437594

Kind Code:

B2

Abstract:

Heteroleptic organometallic compounds containing at least one formamidinate ligand are provided. These heteroleptic organometallic compounds have improved properties over conventional vapor deposition precursors. Such compounds are suitable for use as vapor deposition precursors including direct liquid injection. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds or their solutions in organic solvents.

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Inventors:

Deodatta Vinayak Shenai-Hatohate
Huachie Lee
Ching Min Wang

Application Number:

JP2008146636A

Publication Date:

March 12, 2014

Filing Date:

June 04, 2008

Export Citation:

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Assignee:

Rohm and Haas Electronic Materials, L.L.C.

International Classes:

C23C16/30; C07C257/12; C07F1/02; C07F7/00; C07F15/00; H01L21/316

Domestic Patent References:

JP2006511716A

Foreign References:

WO2007015436A1
WO1995004063A1
US20050042372
US20060046521
WO2006086329A1
WO2004046417A1
WO2007047020A1
WO2008002546A1

Attorney, Agent or Firm:

Patent Business Corporation Sender International Patent Office

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