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Title:
オルガノポリシロキサン化合物およびその製造方法並びにそれを含有する帯電防止剤および硬化性組成物
Document Type and Number:
Japanese Patent JP6958511
Kind Code:
B2
Abstract:
An organopolysiloxane compound represented by average structural formula (1) is capable of imparting an electron beam curable resin with high antistatic properties, while having excellent antistatic performance durability.(In the formula, Z represents a single bond or a group having a functionality of 2-20 and containing an organopolysiloxane structure; R1 represents a single bond, or an unsubstituted or substituted alkylene group having 1-20 carbon atoms; each of R2 and R3 represents an unsubstituted or substituted alkyl group having 1-10 carbon atoms, or the like; Y represents a monovalent hydrocarbon group having a polymerisable reactive group; each of p and q represents a number of 1-10, with (p+q) being 2-20 in accordance with the valence of Z; and in cases where Z represents a single bond, p and q represent 1, A- represents an anion and Q+ represents a cationic group that is represented by one of formulae (2)-(4)(wherein each one of R4-R10 represents an alkyl group having 1-20 carbon atoms, or the like; each one of R11-R13 represents a hydrogen atom or the like; and * represents a bonding hand).)

Inventors:
Tetsuro Yamada
Masahiko Minemura
Application Number:
JP2018153577A
Publication Date:
November 02, 2021
Filing Date:
August 17, 2018
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08F30/08; C07C311/48; C07F7/08; C07F9/54; C07F19/00; C08F290/06; C08G77/22; C09D7/65; C09D183/07; C09D183/08; C09D201/00; C09K3/16
Domestic Patent References:
JP6256421A
JP2000282014A
JP2014227361A
JP6128379A
Attorney, Agent or Firm:
Hideaki International Patent Office



 
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