Title:
マイクロ電子デバイスでの使用のためのオルガノシリケート樹脂調合物
Document Type and Number:
Japanese Patent JP2006522861
Kind Code:
A
Abstract:
A curable organosilicate composition employed to form one or more layers in the fabrication of electronic devices comprises:
(a) an alkoxy or acyloxy silane having at least one group containing ethylenic unsaturation which group is bonded to the silicon atom
(b) an alkoxy or acyloxy silane having at least one group containing an aromatic ring which group is bonded to the silicon atom,
(c) a latent acid catalyst, preferably one or both of a photoacid generator and a thermal acid generator, and
(d) optionally an alkoxy or acyloxy silane having at least one C 1 -C 6 alkyl group bonded to the silicon atom.
Inventors:
Baker Iker, Kiran, Kay.
Feng, Xiaoguan
Hetner, Jack, Yi.
Meeher, John, M
Mills, Michael, Yi.
Popa, Paul, Jay.
Stritt Matter, Richard, Jay.
Wilson, Larry, Earl.
Feng, Xiaoguan
Hetner, Jack, Yi.
Meeher, John, M
Mills, Michael, Yi.
Popa, Paul, Jay.
Stritt Matter, Richard, Jay.
Wilson, Larry, Earl.
Application Number:
JP2006509673A
Publication Date:
October 05, 2006
Filing Date:
March 31, 2004
Export Citation:
Assignee:
Dow Global Technologies Incorporated
International Classes:
C08L83/07; C08K5/42; C08L83/06; C09D183/04; G03F7/075; G03F7/09; H01L21/312; H01L21/768; C08G77/20; G03F7/004
Domestic Patent References:
| JP2005522053A | 2005-07-21 | |||
| JP2005522049A | 2005-07-21 | |||
| JPH06145599A | 1994-05-24 | |||
| JPH06148895A | 1994-05-27 | |||
| JP2001049182A | 2001-02-20 | |||
| JPH04212160A | 1992-08-03 | |||
| JP2001022082A | 2001-01-26 |
Foreign References:
| WO2002016477A2 | 2002-02-28 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Yasuhito Suzuki
Eiji Katayama
Norio Omori
Yasuhito Suzuki