Title:
フレキシブルエレクトロニクスデバイス基板用配向ポリエステルフィルム
Document Type and Number:
Japanese Patent JP4444955
Kind Code:
B2
Abstract:
An object of the invention is to provide such an oriented polyester film that has a constant thickness, and is excellent in dimensional stability at a high temperature and dimensional stability to temperature change in a working temperature range. The invention relates to an oriented polyester film containing as a major component of a substrate layer polyethylene-2,6-naphthalene dicarboxylate, being stretched at least in one direction, and having a film thickness of from 12 to 250 µm, wherein
(1) a coefficient of linear thermal expansion ±t at a temperature of from 30 to 100°C is from 0 to 15 ppm/°C in both longitudinal and width directions of the film, and
(2) a thermal shrinkage rate at 100°C for 10 minutes is 0.5% or less in both longitudinal and width directions of the film.
Inventors:
Katsuyuki Hashimoto
Tetsuo Yoshida
Makoto Tsuji
Shinya Togano
Tetsuo Yoshida
Makoto Tsuji
Shinya Togano
Application Number:
JP2006513627A
Publication Date:
March 31, 2010
Filing Date:
May 12, 2005
Export Citation:
Assignee:
Teijin DuPont Films Co., Ltd.
International Classes:
B29C55/12; B29C55/02; C08J5/18; H05B33/02; H05B33/14; H05K1/03; B29K67/00; B29L7/00; H05K1/00
Domestic Patent References:
| JP2004009362A | ||||
| JP2000085082A | ||||
| JP2001191405A |
Foreign References:
| WO1993020553A1 | ||||
| WO1999029488A1 |
Attorney, Agent or Firm:
Hideko Mihara