配向高分子デバイス - SMITH & NEPHEW,INC.

Title:

配向高分子デバイス

Document Type and Number:

Japanese Patent JP5871464

Kind Code:

B2

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Inventors:

Horacio Monte de Oca Valderas
Malcolm Brown
Mark Bonner
Ian Macmillan Ward
Michael hall
John Rose
Mason betenga

Application Number:

JP2010504272A

Publication Date:

March 01, 2016

Filing Date:

April 18, 2008

Export Citation:

Assignee:

SMITH & NEPHEW,INC.

International Classes:

A61L31/00; A61B17/72; A61F2/28; A61L17/00; A61L27/00

Domestic Patent References:

JP10309313A
JP4990771A

Foreign References:

Attorney, Agent or Firm:

Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro

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