Title:
OSCILLATOR
Document Type and Number:
Japanese Patent JP2017195560
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an oscillator capable of securing sufficient solder thickness easily at low cost and improving heat cycle resistance performance.SOLUTION: The oscillator is so configured that a foot pattern 4 is formed on a glass epoxy substrate 1, a plurality of small parts 3 are mounted on a region of the glass epoxy substrate 1 where the foot pattern 4 is not formed, a large part 2 is mounted on the small part 3, the large part 2 is lifted by the small part 3 to form a gap between the glass epoxy substrate 1 and the large part 2, the gap is filled with solder 5 to connect the foot pattern 4 of the glass epoxy substrate 1 and the terminal electrode of the large-sized component 2.SELECTED DRAWING: Figure 1
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Inventors:
KASAHARA KENJI
Application Number:
JP2016085754A
Publication Date:
October 26, 2017
Filing Date:
April 22, 2016
Export Citation:
Assignee:
NIHON DEMPA KOGYO CO
International Classes:
H03B5/32; H05K1/18; H05K3/34
Attorney, Agent or Firm:
Nobuhiro Funatsu