Title:
OUTER LEAD BONDER
Document Type and Number:
Japanese Patent JPH0513947
Kind Code:
A
Abstract:
PURPOSE: To provide an outer bonder, by which the outer leads, which are mounted by a TAB system, of a semiconductor device can be reliably soldered to conductor wiring on a circuit board.
CONSTITUTION: An outer lead bonder is provided with a rotator 18, which is rotationally moved while pressing an outer lead 13 of a film carrier, and a laser 11, which applies a laser beam 12 to the lead 13 being pressed by the rotator 18 to heat the leads 13.
Inventors:
KANAYAMA SHINJI
KABESHITA AKIRA
OONAKADA SATORU
SHIDA SATOSHI
KABESHITA AKIRA
OONAKADA SATORU
SHIDA SATOSHI
Application Number:
JP16672191A
Publication Date:
January 22, 1993
Filing Date:
July 08, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
Next Patent: JPH0513948