Title:
OVERLAY WOODEN FLOOR HEATING PANEL
Document Type and Number:
Japanese Patent JP3306369
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To lay a floor heating panel on a floor such as the flooring of an existing residence with good workability and without deteriorating the fundamentals of the floor of a room and urge thermal conduction from conduits for heating fluid or heat generating electric wires to a panel body.
SOLUTION: A sheet type wooden floor heating panel comprises recessed grooves 5 for embedding conduits 6 for heating fluid or heat generating electric wires are provided on the back surface of a wooden floor heating panel body 1 provided on the floor of a house and the conduits 6 for heating fluid or the heat generating electric wires embedded in the recessed grooves 5. A thermal conduction urging film in which metallic powder with good thermal conductivity is mixed is formed substantially on all area of the back surface of the wooden floor heating panel main body including the recessed grooves 5.
More Like This:
| JPH11132478 | TATAMI-HEATING SYSTEM |
| JP3050842 | METHOD WHICH FIXES PLYWOOD WITH FLOOR HEATING PANEL |
Inventors:
Nobuyuki Kasukawa
Application Number:
JP6855598A
Publication Date:
July 24, 2002
Filing Date:
March 18, 1998
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
F24D3/16; F24D13/02; (IPC1-7): F24D3/16; F24D13/02
Domestic Patent References:
| JP1162104A | ||||
| JP11237060A | ||||
| JP1114083A | ||||
| JP112418A | ||||
| JP11264556A | ||||
| JP11230558A | ||||
| JP10170007A |
Attorney, Agent or Firm:
Masamasa Shibano