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Title:
オキサジン化合物、組成物及び硬化物
Document Type and Number:
Japanese Patent JP6697183
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a new oxazine compound which is excellent in heat resistance and low thermal expansion property and is also excellent in adhesion and moisture resistance/solder resistance; a composition containing the new oxazine compound, a cured product and a laminate containing the cured product; and a heat-resistant material and an electronic material containing the new oxazine compound.SOLUTION: There are provided an oxazine compound having an aromatic ring structure and a group having a plurality of specified carbon-carbon triple bond structures; a composition containing the oxazine compound, a cured product containing the composition and a laminate having the cured product layer; and a composition for heat-resistant material and a composition for electron material containing a composition containing the oxazine compound.SELECTED DRAWING: None

Inventors:
Tomohiro Shimono
Kazuo Arita
Junji Yamaguchi
Ritsu Otsu
Application Number:
JP2016127581A
Publication Date:
May 20, 2020
Filing Date:
June 28, 2016
Export Citation:
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Assignee:
DIC Corporation
International Classes:
C07D265/16; C08G14/073; C08G73/00; C08J5/24; C08K3/00; C08L61/22
Domestic Patent References:
JP11012258A
JP2000169456A
JP2015203041A
JP2003286466A
JP2002241495A
Foreign References:
CN102219785A
Other References:
J. APPL. POLYM. SCI.,2013年,pp.516-522
JOURNAL OF POLYMER SCIENCE, PART A: POLYMER CHEMISTRY,2016年,54,pp.2811-2819
High Performance Polymers,2015年,27(2),pp.217-225
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno