Title:
OXYGEN CONCENTRATION MONITORING METHOD, OXYGEN CONCENTRATION MONITORING SYSTEM AND LASER PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2021178344
Kind Code:
A
Abstract:
To reduce sputtering in laser processing in which laser light is used to fuse or weld an object made of an aluminum or aluminum alloy.SOLUTION: An oxygen concentration monitoring method (M10) includes: an image acquisition step (S11) of acquiring an image of a region including an irradiation point of laser light; a first region specifying step (region specifying step S12) of specifying a light emission region; a size specifying step (S13) of specifying the size of the light emission region; and an oxygen concentration determination step (S14) of determining whether the size is less than a predetermined threshold, and then determining that oxygen concentration is less than a predetermined first reference value when the determination result indicates that the size is less than the predetermined threshold.SELECTED DRAWING: Figure 1
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Inventors:
KAWADA YOSHITAKA
Application Number:
JP2020084449A
Publication Date:
November 18, 2021
Filing Date:
May 13, 2020
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
B23K26/142; B23K26/00; B23K26/21; B23K26/354
Attorney, Agent or Firm:
Harakenzo world patent & trademark