Title:
OXYGEN PUMP ELEMENT
Document Type and Number:
Japanese Patent JP3855776
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem of temperature rise due to current concentration in an oxygen bump element.
SOLUTION: Current concentration is reduced by providing a first lead connection electrode in contact with the outer edge section of a first working electrode formed on one surface of an oxygen ion conductive substrate, and a second lead connection electrode in contact with the outer edge section of a second working electrode formed on the other of the oxygen ion conductive substrate.
Inventors:
Akira Nagai
Yu Fukuda
Naoko Ikukawa
Yu Fukuda
Naoko Ikukawa
Application Number:
JP2002008383A
Publication Date:
December 13, 2006
Filing Date:
January 17, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
G01N27/41; G01N13/02; (IPC1-7): G01N27/41
Domestic Patent References:
| JP8136497A | ||||
| JP10170476A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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