Title:
【発明の名称】半導体基板の製造方法
Document Type and Number:
Japanese Patent JP2584639
Kind Code:
B2
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Inventors:
ARIMOTO YOSHIHIRO
Application Number:
JP27193787A
Publication Date:
February 26, 1997
Filing Date:
October 29, 1987
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/31; H01L21/02; H01L27/12; (IPC1-7): H01L27/12
Attorney, Agent or Firm:
Seiichi Samukawa