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Patent Searching and Data


Title:
【発明の名称】補綴部材の製造法
Document Type and Number:
Japanese Patent JP2769357
Kind Code:
B2
Abstract:
A process for the preparation of a prosthetic device using a CAD/CAM system to effect polymerisation of a photo-polymerisable composition by subjecting it to suitable electromagnetic radiation to cure it in the shape and size of the desired prosthetic device. Preferably the polymerisation is effected such that adjacent lamellae are cohesively integrated as they are formed.

Inventors:
Michael Edward Bennett Jeonz
Iyuan Thomas
Application Number:
JP15979089A
Publication Date:
June 25, 1998
Filing Date:
June 23, 1989
Export Citation:
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Assignee:
Zeneca Limited
International Classes:
A61C5/77; A61C13/00; A61F2/02; A61F2/30; A61L27/00; (IPC1-7): A61F2/02; A61L27/00
Attorney, Agent or Firm:
Shigeru Yagita (2 outside)