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Title:
【発明の名称】半田の濡れ性測定装置
Document Type and Number:
Japanese Patent JP3361204
Kind Code:
B2
Abstract:
The purpose of the present invention is to propose an apparatus for measuring wetness property of solder with very excellent measurement sensitivity. The apparatus for measuring wetness property of solder according to the present invention is characterized in that it comprises a differential transformer which is fixed, a balance which is supported by a balancing fulcrum, a metallic test piece which hangs from the detection element of said differential transformer through an end of said balance, a counterweight which hangs from the other end of said balance, a solder tank which is filled with molten solder, a vertical movement apparatus which moves up and down said solder tank, a contact detection circuit which produces an output signal when said metallic test piece comes into contact with said molten solder in said solder tank, and a data processing apparatus which gains the wet depth of said metallic test piece into said molten solder and the wetting speed by using the output signal from said contact detection circuit as a trigger and which indicates them.

Inventors:
Toranosuke Kawaguchi
Mitsuo Kojima
Application Number:
JP34031294A
Publication Date:
January 07, 2003
Filing Date:
December 28, 1994
Export Citation:
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Assignee:
Nihon Almit Co., Ltd.
International Classes:
G01N13/00; B23K1/00; G01N13/02; H05K3/34; (IPC1-7): G01N13/00; B23K1/00
Domestic Patent References:
JP52106788A
JP51136484A
JP5523436A
JP5582039A
JP4147762A
Other References:
川口寅之輔、小嶋光夫、前園明一、長屋浩,“濡れ速度試験器の試作”,1st Symposium on“Microjoining and Assembly Technology in Electronics”,日本,Japan Welding Society,1995年2月10日,pp.111−114
Attorney, Agent or Firm:
Kazunori Saito