PURPOSE: To secure insulation reliability to reduce conductor resistance to enhance Q by a method wherein a coil conductor is formed on an insulation film so that each vicinity of both end parts is superimposed on a part of a different lower conductor.
CONSTITUTION: At least two lower conductors 4, 6 are formed from the vicinity of an end part on one surface of an insulation substrate 1 from substantially a center part, and an insulation film 3 is formed so as to coat the lower conductors 4, 6. At least one coil conductor 2 is formed on the insulation film 3 so that each vicinity of the end part is superimposed on a part of the different lower conductors 4, 6. At least two electrodes 5, 5 are formed so that they are superimposed on each of the lower conductors 4, 6 in the vicinity of the end part of the insulation substrate 1. Incidentally, the insulation substrate 1 is a ceramic substrate and the lower conductors 4, 6 are conductors that are pattern-formed at a specific thickness by thick film technique and a coil conductor 2 is a conductor that is formed at a specific thickness by plating.
| JPH062659 | [Name of invention] Planar inductor |
| WO/2013/152981 | COMMON MODE INDUCTOR DEVICE |
| JP2006294891 | METHOD OF MANUFACTURING ELECTRONIC PART |
MORIYA SATOSHI
MACHIDA HIDEKI
KUDO TOSHIHIKO
| JPS486749A | ||||
| JPS53115350U | 1978-09-13 | |||
| JPH04223307A | 1992-08-13 |