Title:
【発明の名称】超短パルス高繰り返し速さの生物組織の処理用レーザシステム
Document Type and Number:
Japanese Patent JPH11504843
Kind Code:
A
Abstract:
The invention consists of a method for high precision machining (cutting, drilling, sculpting) of metals and alloys. By using pulses of a duration in the range of 10 femtoseconds to 100 picoseconds, extremely precise machining can be achieved with essentially no heat or shock affected zone. Because the pulses are so short, there is negligible thermal conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond approximately 0.1-1 micron (dependent upon the particular material) from the laser machined surface. Due to the short duration, the high intensity (>1012 W/cm2) associated with the interaction converts the material directly from the solid-state into an ionized plasma. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces with negligible redeposition either within the kerf or on the surface. Since there is negligible heating beyond the depth of material removed, the composition of the remaining material is unaffected by the laser machining process. This enables high precision machining of alloys and even pure metals with no change in grain structure.
Inventors:
Neve, Joseph
Da Sylvia, Louise Bee.
Matthews, Dennis El.
Grinsky, Michael E.
Stuart, Brent See.
Perry, Michael Dee.
Fate, Michael Dee.
Ruben Beck, Alexander M.
Da Sylvia, Louise Bee.
Matthews, Dennis El.
Grinsky, Michael E.
Stuart, Brent See.
Perry, Michael Dee.
Fate, Michael Dee.
Ruben Beck, Alexander M.
Application Number:
JP52314297A
Publication Date:
May 11, 1999
Filing Date:
January 06, 1997
Export Citation:
Assignee:
The Regents of the University of California
International Classes:
A61B18/26; A61C3/02; A61N5/06; A61B18/20; B23K26/03; B23K26/06; B23K26/18; B23K26/36; B23K26/40; C06B21/00; (IPC1-7): A61B17/36; A61C3/02; A61N5/06
Attorney, Agent or Firm:
Takashi Ishida (3 others)