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Title:
PACK PLATING PROCESS
Document Type and Number:
Japanese Patent JPH07109579
Kind Code:
A
Abstract:

PURPOSE: To plate the surface of an article with metal by heating the article together with a metallizing powder pack.

CONSTITUTION: This process is a pack plating process where a density driven flow of plating gas is allowed to pass through a powder pack over the whole plating process. A crucible 11 used in the powder pack plating process has an aperture 13 below the upper surface of the powder pack to allow the density driven flow of the plating gas generated by the powder pack to move through the powder pack.


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Inventors:
ROBAATO UINSUTON JIYONSON
IAN KENESU JIRETSUTO
POORU SHIIN JIYON MAGURASU
KORIN RODONII UIIBAA
Application Number:
JP11232791A
Publication Date:
April 25, 1995
Filing Date:
April 17, 1991
Export Citation:
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Assignee:
ROLLS ROYCE PLC
International Classes:
C23C24/08; C23C8/68; C23C10/34; (IPC1-7): C23C24/08
Attorney, Agent or Firm:
Kazuo Sato (2 outside)



 
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