Title:
PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3145602
Kind Code:
B2
Abstract:
PURPOSE: To easily, rigidly and electrically connect each electrode with bonding pads by suing short bonding wires which do not cause malfunction to a semiconductor element, by stretching a part of bonding pads on a film for preventing flowing-in whose wetability to a conducting adhesive part member is low.
CONSTITUTION: A plurality of bonding pads 8 with which electrodes of a semiconductor element 4 are electrically connected via bonding wires 9 are formed. An insulating frame body 2 and a lid body 3 which are joined to the upper surface of an insulating substrate 1, while surrounding a die pad 6 and the bonding pads 8 are formed. A film 11 for preventing flowing-in whose wetability to a conducting adhesive part member 7 is low is stuck on connection conductor 10 of the insulating substrate 1. A part of the bonding pads 8 is stretched on the film 11. Thereby the conducting adhesive part member 7 is prevented from flowing in the bonding pads 8, and the bonding wires 9 can be made to approach the die pad 6.
Inventors:
Mitsuo Yanagisawa
Application Number:
JP7196795A
Publication Date:
March 12, 2001
Filing Date:
March 29, 1995
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/60; H01L23/02; H01L23/04; (IPC1-7): H01L23/02
Domestic Patent References:
| JP3248541A |