Title:
PACKAGE CONSTRUCTION OF CIRCUIT ELEMENT
Document Type and Number:
Japanese Patent JPS54134356
Kind Code:
A
Inventors:
SONODA MASAO
Application Number:
JP4133578A
Publication Date:
October 18, 1979
Filing Date:
April 10, 1978
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K7/20; H05K7/04; (IPC1-7): H05K7/04; H05K7/20