Title:
PACKAGE FOR HIGH FREQUENCY CIRCUIT
Document Type and Number:
Japanese Patent JP3463720
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce a route difference between hot current and return current by providing a ground pattern and side through holes or upper face ground patterns connected by side.plating on both sides of a strip line positioned in a connection part with an external circuit.
SOLUTION: The upper face ground patterns 22 are formed on a low layer dielectric substrate 7 and the ground pattern 11 and the upper ground patterns 22 are connected by the side through holes 23. The strip line pattern 10 and the upper face ground patterns 22 form the coplanar line 24. The strip line patterns 10a and 10b are connected by a gold wire 25, and the upper face ground patterns 22a and 22b are connected by a gold wire 25. When a clearance exists between packages for high frequency circuit, high frequency return current 19 flows through the wire 25. Thus, the route difference with hot current can be suppressed to be about twice as much as the height of the low layer dielectric substrate 7. Consequently, the route difference between hot current and return current can be reduced.
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Inventors:
Kazuki Inami
Michiaki Kasahara
川▲の▼ 肇
Hideyuki Koide
Michiaki Kasahara
川▲の▼ 肇
Hideyuki Koide
Application Number:
JP1994596A
Publication Date:
November 05, 2003
Filing Date:
February 06, 1996
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K1/02; H01P1/00; H01P1/04; H01P3/02; H01P3/08; H01P5/02; H05K1/14; H05K3/32; H05K3/36; (IPC1-7): H05K1/02; H01P1/00; H01P1/04; H01P3/02; H01P3/08; H01P5/02
Domestic Patent References:
| JP2159103A | ||||
| JP61182098U |
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)