Title:
PACKAGE FOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS5336468
Kind Code:
A
Abstract:
PURPOSE: To decrease the line voltage fall for an IC package by utilizing the cap ring for apart of the feeding line to the IC chip.
Inventors:
ISOBE TERUO
Application Number:
JP11079976A
Publication Date:
April 04, 1978
Filing Date:
September 17, 1976
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/12; H01L23/02; H01L23/04; H01L23/50; (IPC1-7): H01L23/02; H01L23/50