Title:
PACKAGE FOR LSI
Document Type and Number:
Japanese Patent JPS61102746
Kind Code:
A
Abstract:
PURPOSE:To prevent the breaking of an LSI chip on a short circuit by directly connecting an electric-supply terminal for an LSI-chip loading substrate and an LSI-chip loading metallic plate electrically. CONSTITUTION:Pin terminals 25 for feeding power supply are connected electrically to an LSI-chip loading metallic plate 21' by wirings 29 in a substrate, and the wirings 29 in the substrate can be realized easily by a formation through a through-hole printing technique. The electric resistance of the wirings 29 can further be reduced by shaping a plurality of the wirings 29. Accordingly, when a heat sink is brought into contact with a grounding section for a frame, etc. for an apparatus, short-circuit currents pass and flow through the wirings 29 in an LSI-chip loading substrate having a small resistance value, thus resulting in little currents passing through the inside of an LSI chip.
Inventors:
KADOMA YASUYUKI
Application Number:
JP22541984A
Publication Date:
May 21, 1986
Filing Date:
October 26, 1984
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/52; H01L21/58; H01L21/60; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Kurita Haruo