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Title:
PACKAGE MADE OF ULTRAVIOLET EFFACEMENT TYPE PROM
Document Type and Number:
Japanese Patent JPS5678143
Kind Code:
A
Abstract:

PURPOSE: To prevent a wiring information from changing due to an electric charge charged to a glass, by a method wherein a conductive film, permeating ultraviolet rays, is adhered to the reverse side of a glass for ultraviolet irradiation mounted at a lid member of which a package consists.

CONSTITUTION: A semiconductor element 2 is contained in an element-containing part 1 having outer connection terminals 3, and electrode terminals mounted at the semiconductor element are connected to bonding pad 4 of the containing part 1 by the use of fine wires 5. An upper open end of the containing part 1 is covered with a kovar lid member 6 having a glass 7 for ultraviolet irradiation. With this an indium tin film 9 of about 1μm thick which permits incidence of ultraviolet rays is newly adhered to the reverse side of the glass 7 for ultraviolet irradiation, and said film is connected to the lid member 6, lead strips 8 and pad 4 placed at the containing part 1, and further to the outer connection terminals 3. This causes rapid discharge toward earth of an electric charge charged to the glass 7.


Inventors:
TANAKA IZUMI
SHIRAI KAZUNARI
Application Number:
JP15455279A
Publication Date:
June 26, 1981
Filing Date:
November 29, 1979
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01L23/02; G11C16/18; (IPC1-7): H01L23/06
Domestic Patent References:
JPS55154753A1980-12-02