Title:
PACKAGE FOR OPTICAL WAVEGUIDE TYPE MODULE
Document Type and Number:
Japanese Patent JP2004138971
Kind Code:
A
Abstract:
To provide a package with which the uniformity of the temperature of a chip in an optical waveguide type module, the reduction of the stress to be exerted on the chip and the reduction of the electric power consumption of a heating means for heating the chip can be achieved.
The optical waveguide type module includes the chip 20 formed with a waveguide, an aluminum heater 24 for heating the chip, and a highly thermally-conductive material 26, such as a Cu-W alloy, interposed between the chip and the heater in such a manner that the heat of the heater is evenly distributed and conducted to the chip.
Inventors:
YONEKURA HIDEKI
Application Number:
JP2002305891A
Publication Date:
May 13, 2004
Filing Date:
October 21, 2002
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
G02B6/12; (IPC1-7): G02B6/12
Attorney, Agent or Firm:
Takashi Ishida
Masaya Nishiyama
Higuchi Souji
Masaya Nishiyama
Higuchi Souji
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