Title:
パッケージ、パッケージ製造方法、接合材付き蓋体、および接合材付き蓋体の製造方法
Document Type and Number:
Japanese Patent JP7283476
Kind Code:
B2
Abstract:
This package includes a substrate, a lid body, and a bonding layer that bonds the lid body to the substrate. The bonding layer includes a first metallized layer formed in a frame-shape having a predetermined width on a main surface of the lid body, and a braze layer laminated on the first metallized layer on a side opposite the lid body. The first metallized layer on the surface bonded to the lid body has a width that is greater than the width of the braze layer.
Inventors:
Seiichi Izawa
Ryota Majima
Michiyuki Nakamura
Hiroshi Sasaki
Ryota Majima
Michiyuki Nakamura
Hiroshi Sasaki
Application Number:
JP2020530100A
Publication Date:
May 30, 2023
Filing Date:
June 27, 2019
Export Citation:
Assignee:
Nippon Electric Glass Co., Ltd.
International Classes:
H01L23/02; C03C3/091; H01L23/08
Domestic Patent References:
| JP2009200093A | ||||
| JP2017527113A | ||||
| JP2014236202A | ||||
| JP2013026919A |
Foreign References:
| WO2015046209A1 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda