PURPOSE: To obtain a package effectively shielding radiation by using ceramics or a resin containing at least one kind of an element of Pb, Au, Hf, Ir, Mo, Os, Pd, Pt, Re, Ta, Tb, Tl, W and U at a weight ratio of 1% or moe as a material for the package employed for sealing a semiconductor device.

CONSTITUTION: Electrode wirings formed to a semiconductor device 1 are connected to terminals 2, and the whole is surrounded by a package 3 consisting of ceramics or epoxy resin while exposing the outsides of the terminals. A material for the package 3 contains at least one kind of Pb, Au, Hf, Ir, Mo and other materials by 1wt% of more in the constitution, and the package 3 is given a radiation shielding effect. Accordingly, malfunction or the change of characteristics is not generated in the semiconductor device 1, and the reliability of the device is improved.