Title:
PACKAGE FOR SEMICONDUCTOR LIGHT-EMITTING APPARATUS, AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS
Document Type and Number:
Japanese Patent JP2009188069
Kind Code:
A
Abstract:
To provide a semiconductor light-emitting apparatus which can eliminate an area loss of a reflecting plate caused by arranging a bonding electrode and can arrange an optical semiconductor element in a center of the reflecting plate and can be miniaturized.
In an optical impermeable member 6 which uses a conical concave portion as a reflecting plate 8, since it is possible to arrange an optical semiconductor element 3 in a center of the concave portion without producing any loss of a reflective effective area of the reflecting plate 8 by forming an electrode 2 for bonding at the same surface as an inner wall side surface of the concave portion, it is possible to realize miniaturization and to raise luminous efficiency.
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Inventors:
OSATO KAZUHIDE
Application Number:
JP2008024626A
Publication Date:
August 20, 2009
Filing Date:
February 05, 2008
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L33/48; H01L33/60; H01L33/62
Attorney, Agent or Firm:
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada
Toshiji Sasahara
Yohei Harada