Title:
PACKAGE FOR SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH06112338
Kind Code:
A
Abstract:
PURPOSE: To obtain a package for a semiconductor for which a glass seal showing a high electromagnetic shield effect and little nonuniformity in an input/ output impedance is used.
CONSTITUTION: A metal base 1 for packaging a semiconductor chip 6 is connected to a metal frame 2 by erecting a part of the base other than a glass seal part 4, and joined electrically to a cover 5. Since the height of the erected sides 1b and 1c of the metal base 1 equals the thickness of the glass seal 4, nonuniformity in package dimensions is lessened. Accordingly, a package for a semiconductor showing a high electromagnetic shield effect and a stable input/output impedance is obtained.
Inventors:
MATSUMOTO HIDEO
MIYAWAKI KATSUMI
MIYAWAKI KATSUMI
Application Number:
JP28406992A
Publication Date:
April 22, 1994
Filing Date:
September 28, 1992
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/02; (IPC1-7): H01L23/02
Attorney, Agent or Firm:
Kenichi Hayase