Title:
多数個取り素子収納用パッケージおよび多数個取り光半導体装置
Document Type and Number:
Japanese Patent JP7072045
Kind Code:
B2
Abstract:
A multipiece element storage package of the present disclosure includes: a mother substrate which includes first element storage package regions, second element storage package regions, a dummy region, a first surface, and a second surface; a first stem electrode disposed in a part of the dummy region which part is in the first surface; and a second stem electrode disposed on the second surface. The first element storage package regions and the second element storage package regions each include a frame body disposed on the first surface, a first wiring conductor disposed on the first surface, and including one end located inside the frame body and the other end connected to the first stem electrode, and a second wiring conductor including one end which is located on the first surface and inside the frame body and the other end which is connected to the second stem electrode.
Inventors:
Daisuke Ueyama
Chiaki Domoto
Chiaki Domoto
Application Number:
JP2020500566A
Publication Date:
May 19, 2022
Filing Date:
February 14, 2019
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01S5/0233; H01L21/60; H01L23/02; H01L23/04; H01L33/62; H01S5/0239; H01S5/40
Domestic Patent References:
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| JP2015144234A | ||||
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Foreign References:
| WO2011077900A1 | ||||
| WO2017009183A1 | ||||
| US20120244651 | ||||
| US6531328 |
Attorney, Agent or Firm:
Nishikyo Keiichiro
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