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Patent Searching and Data


Title:
PACKAGE WITH INNER PRESSURE ADJUSTED AND PACKAGING MATERIAL USED THEREFOR
Document Type and Number:
Japanese Patent JPH0692386
Kind Code:
A
Abstract:

PURPOSE: To completely maintain bundling of a packaged object without causing physical damage and electrostatic damage such as friction with a film and flaw due to the friction by making an inner pressure of a package of a synthetic resin film a specific pressure.

CONSTITUTION: In a package wherein an object is packaged by a synthetic resin film, an inner pressure of the package is made at least in a range of 10 to 500Torr. In the case of deairing down to 10Torr or lower, it is in a region of a so-called vacuum wrapping, where occurrence of damage of the packaged object and a pin hole or breakage of a wrapping material is noticeable. In the case of deairing up to 500Torr or higher, bundling of the packaged object cannot be maintained. Although the packaged object is not specifically limited, such objects with a small sensitive region to static electricity and sensitive to damage are suitable, and electronic parts are particularly preferable. In the case of the electronic parts, a film for protecting the objects against electrical damage is equipped with conductivity on an outer layer and anti-static property on an inner layer.


Inventors:
KANEIZUMI KAZUHISA
TOBIYO YOSHIKUNI
Application Number:
JP10504291A
Publication Date:
April 05, 1994
Filing Date:
April 11, 1991
Export Citation:
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Assignee:
NIPPON CARBIDE KOGYO KK
International Classes:
B65D85/00; B65D85/38; B65D85/86; (IPC1-7): B65D85/38; B65D85/00