Title:
PACKAGE WITH RF TAG
Document Type and Number:
Japanese Patent JP2022036446
Kind Code:
A
Abstract:
To provide a package with an RF tag in which even though an RF tag label is attached from a top of an opening hole provided in the package made of metallic material, an adhesive layer of the RF tag label is not exposed at a portion of the opening hole on a side opposite to where the RF tag label is affixed, .SOLUTION: In a package with an RF tag 1, on an RF tag label 2, the whole of an opening hole 12 is blocked by a detackifying layer 25 and a part or all of a planar coupling element 221 is attached to a package 10 so as to overlap a metallic material 100c of the package 10 via at least a second adhesive layer 24. The opening hole 12 is sized to accommodate the whole of a matching circuit 220, and the detackifying layer 25 is laminated on a back surface of the second adhesive layer 24 according to an arrangement position of the matching circuit 220 and has a shape in which circumference of the opening hole 12 is widened.SELECTED DRAWING: Figure 1
Inventors:
OGATA TETSUJI
Application Number:
JP2020140654A
Publication Date:
March 08, 2022
Filing Date:
August 24, 2020
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G06K19/077; H01Q1/38; H01Q1/40
Attorney, Agent or Firm:
Hiromi Fujimasu
Fukamachi Keiko
Hideo Ito
Naoki Goto
Hideyuki Tateishi
Fukamachi Keiko
Hideo Ito
Naoki Goto
Hideyuki Tateishi