Package

Japanese Patent JP6017547

B2

The present invention provides a method for forming a naked collation package comprising a) providing an arrangement of packages individually wrapped in a filmic material; b) providing a naked collation film for nakedly wrapping said individually wrapped packages, the naked collation film comprising a polyoiefinic core layer C, an inner sealing layer A on the inner surface of the naked collation film and a polyoiefinic outer sealing layer B on the outer surface of the naked collation film, the material of the inner sealing layer A being selected for sealing incompatibility with the filmic material of the individually wrapped packages under a specified sealing condition and heat shrinking condition, and the polyoiefinic material of the outer sealing layer B being selected for sealing compatibility with B and for sealing compatibility with A under the specified sealing condition, wherein layers A and B are formed of different materials and layer B comprises at feast one polyoiefinic polymer and an antiblock component comprising at feast 0.2% by weight of the layer of silicone; c) arranging the individually wrapped packages in an ordered configuration; d) arranging the naked collation film such that it at feast partially surrounds, although is not necessarily in contact with, the ordered configuration of individually wrapped packages; and e) heat shrinking the naked collation film by exposing it to the heat shrinking condition, causing the naked collation film to shrink and closely surround the arrangement of packages, without being sealed to the packages. Naked collation film wrapped packages are also disclosed.

Shin, Charendra

JP2014513254A

November 02, 2016

June 01, 2012

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Innovia Films Limited

B65B53/00; B32B27/32; B65D65/40; B65D71/08

JP2010536672A
JP2503415A
JP2003511275A

Seiji Ohno
Kenichi Katayama

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