Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PACKAGED BAKERY PRODUCT WHEAT FLOUR COMPOSITION, PACKAGED BAKERY PRODUCT MIX, AND PACKAGED BAKERY PRODUCT PRODUCING METHOD
Document Type and Number:
Japanese Patent JP2023132354
Kind Code:
A
Abstract:
To provide a composition for producing dough of a packaged bakery product, capable of producing a packaged bakery product having less recesses and wrinkles on the surface and having a highly resilient (soft) food texture even after the elapse of a certain period of time after production, and a method of producing a packaged bakery product.SOLUTION: There are provided: a wheat flour composition for producing a packaged bakery product in which dough is used, the composition containing wheat flour obtained from Australian wheat; a mix containing the wheat flour composition for producing a packaged bakery product, in which the wheat flour composition is the packaged bakery product wheat flour composition of the present invention; and a method of producing a packaged bakery product comprising a step for preparing dough using the wheat flour composition of the present invention or the mix of the present invention, a step for preparing packaged dough using the dough, and a step for heating the packaged dough.SELECTED DRAWING: None

Inventors:
YAMADA MASAYUKI
Application Number:
JP2022037617A
Publication Date:
September 22, 2023
Filing Date:
March 10, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA SANGYO CO
International Classes:
A21D6/00; A21D2/36; A21D13/00; A21D13/31; A21D13/40; A21D13/60; A23L35/00
Attorney, Agent or Firm:
Goro Nomura