Title:
Packaging device
Document Type and Number:
Japanese Patent JP6256474
Kind Code:
B2
Abstract:
A packaging device includes a resin film, a covering device, and a heating device. The film includes a welding portion containing a hot melt adhesive and is capable of being welded to a portion to be welded. The covering device covers, with the film, at least a part of a packaging object placed on a base formed of corrugated cardboard and at least a part of the base. The heating device heats a contact portion with the base in a state in which the welding portion of the film is in contact with the base. When heat is added by pressing the welding portion against the base, the hot melt adhesive in the welding portion melts and bonds the corrugated cardboard and the film. Polar functional groups introduced into the surface layer of the film are mixed and combined with the functional groups contained in a fiber of the base.
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Inventors:
Haruki Matsumoto
Toshihiro Takahashi
Toshihiro Takahashi
Application Number:
JP2015534050A
Publication Date:
January 10, 2018
Filing Date:
June 23, 2014
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B65B11/08; B65B41/12
Domestic Patent References:
| JP11171117A | ||||
| JP2011189954A | ||||
| JP11001203A | ||||
| JP2001010605A | ||||
| JP11124119A | ||||
| JP2003096391A | ||||
| JP2002068131A | ||||
| JP5068808U | ||||
| JP3059954U | ||||
| JP59187510A |
Attorney, Agent or Firm:
Hisashi Yamamoto
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