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Title:
低温塗布ホットメルト接着剤配合物の包装
Document Type and Number:
Japanese Patent JP2004518789
Kind Code:
A
Abstract:
Films having a melting point below about 100°C are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking.

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Inventors:
Paul, Charles W.
Rogers, Anthony Pee.
Application Number:
JP2002561570A
Publication Date:
June 24, 2004
Filing Date:
October 31, 2001
Export Citation:
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Assignee:
National Starch and Chemical Investment Holding Corporation
International Classes:
C09J201/00; B29B13/02; B65B63/08; C09J123/02; C09J123/08; (IPC1-7): C09J201/00
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Akemi Hino
Masaya Nishiyama



 
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