Title:
包装材、ケースおよび蓄電デバイス
Document Type and Number:
Japanese Patent JP6862084
Kind Code:
B2
Abstract:
The packaging material includes a heat-resistant resin layer 2 as an outer side layer, a heat-fusible resin layer 3 as an inner side layer, and a metal foil layer 4 arranged between these layers. The heat-resistant resin layer 2 is made of a heat-resistant resin film having a hot water shrinkage rate of 1.5% to 12% and the heat-resistant resin layer 2 and the metal foil layer 4 are adhered via an outer side adhesive layer 5. The adhesive layer 5 is formed by an urethane adhesive agent containing a polyol, a polyfunctional isocyanate compound, and an aliphatic compound containing a plurality of functional groups capable of reacting with an isocyanate group in one molecule. With this, a packaging material can be provided in which excellent formability can be secured and delamination can be sufficiently suppressed without causing pinholes, etc., even when deep depth drawing is performed.
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Inventors:
How way
Hiroaki Ito
Takashi Nagaoka
Makoto Karatsu
Hiroaki Ito
Takashi Nagaoka
Makoto Karatsu
Application Number:
JP2015199410A
Publication Date:
April 21, 2021
Filing Date:
October 07, 2015
Export Citation:
Assignee:
Showa Denko Packaging Co., Ltd.
International Classes:
B65D65/40; B32B7/027; B32B15/08; B65D1/26; H01G11/78; H01M50/10; H01M50/119; H01M50/121; H01M50/129; H01M50/131
Domestic Patent References:
| JP2015142995A | ||||
| JP201544626A | ||||
| JP2015166261A | ||||
| JP201522910A |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Hisayoshi Shimizu
Ken Takada