Title:
PACKAGING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5339868
Kind Code:
A
Abstract:
PURPOSE:To improve packaging yield by positively aligning the positions of the electrode patterns of elements and the protrusions of lead fingers and performing bonding simultaneously.
Inventors:
TOMITA IKUO
ITOU EIICHI
ITOU EIICHI
Application Number:
JP11365076A
Publication Date:
April 12, 1978
Filing Date:
September 24, 1976
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60