Title:
パッケージ用板紙およびその製造方法
Document Type and Number:
Japanese Patent JP6911958
Kind Code:
B2
Abstract:
A packaging paperboard is provided that includes two or more layers with an antenna pattern printed on one layer of the two or more layers, and an RFIC element adhered to the other layer of the two or more layers. In a laminate having the layers stuck together, the RFIC element and the antenna pattern are interposed between the layers to configure an RFIC device in which the RFIC element and the antenna pattern are electrically connected.
Inventors:
Tokiko Kato
Teppei Miura
Teppei Miura
Application Number:
JP2020042206A
Publication Date:
July 28, 2021
Filing Date:
March 11, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G06K19/077; B65D77/00; H01P11/00; H01Q1/38
Domestic Patent References:
| JP2005326919A | ||||
| JP2007108983A | ||||
| JP2006318039A | ||||
| JP2011103060A | ||||
| JP2006347173A | ||||
| JP2003229456A | ||||
| JP2006079258A | ||||
| JP2009301276A |
Attorney, Agent or Firm:
Norihito Yamao
Hiroshi Okabe
Hiroshi Okabe