To provide the packaging structure of an electronic component, in which strip grooves are formed in the peripheral edges of the upper surface of a package 4 formed by molding an electronic element, and which is formed by wire-bonding a semiconductor which is chip 2 mounted on an island 1 to inner frames on the periphery of the island through gold wires, with a sealing resin.

In a BGA semiconductor device having a structure with a semiconductor chip mounted on a land, strip grooves with the inner bottoms formed into an R-type of a curved form at a constant depth are formed in the peripheral edges of the upper surface of a package formed by packaging an electronic element molded with a sealing resin, and piers are formed on the peripheral edges of the package in the outer peripheries of the strip grooves, as needed. Accordingly, even if an electronic component is miniaturized and is thinned and even if the sealing resin in the package is warped by a shrinkage in the package due to generation of heat, the reaction force of the warpage on the package is absorbed in the strip grooves in the peripheral edges of the package, a forced stress is not exerted on the resin, cracks are prevented from being generated in the package, and the chip in the package can be prevented from being damaged.