Title:
Packaging structure and method for manufacturing the packaging structure
Document Type and Number:
Japanese Patent JP6321620
Kind Code:
B2
Abstract:
The invention relates to a packaging construction (1) being formed by multi-layer board material (6) comprising a middle layer (8), a first outer layer (7) attached to the middle layer (8) and a second outer layer (9) attached to the middle layer (8), said packaging construction (1) defining a bottom side (3) a top side (2) and a plurality of side panels (4) joining said bottom side (3) and said top side (2) so as to form a closed structure, wherein at least one edge (14) is defined between adjacent side panels (4). The invention is arranged so that the second outer layer (9) has a lower bending stiffness according to ISO 5628 than the first outer layer (7) such that said board (6) is outwardly bendable only in a direction towards which the second layer (9) faces, and in that said packaging construction (1) is formed with at least one side panel (4) being curved and/or at least one edge (14) being rounded.
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Inventors:
Magnus Vistalem
Ricardo Hegrund
Volke Estelberg
Ricardo Hegrund
Volke Estelberg
Application Number:
JP2015501618A
Publication Date:
May 09, 2018
Filing Date:
March 22, 2012
Export Citation:
Assignee:
Ssear Forest Products Arb
International Classes:
B65D3/02; B32B1/02; B32B21/02
Domestic Patent References:
| JP2008201423A | ||||
| JP5330431U | ||||
| JP50118239U | ||||
| JP3160065U | ||||
| JP3006889U |
Foreign References:
| US20050199692 | ||||
| DE4341129A1 | ||||
| US4286006 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe
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