Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PACKAGING STRUCTURE AND PACKAGING METHOD FOR OPTICAL WAVEGUIDE AND OPTICAL FIBER
Document Type and Number:
Japanese Patent JPH0727946
Kind Code:
A
Abstract:

PURPOSE: To provide a packaging strucrue for an optical waveguide and optical fiber which maintains initial characteristics over a long period of time even at and under a high temp. and high humidity and withstands vibrations and impact, and a packaging method.

CONSTITUTION: An end face 4 of an optical waveguide substrate 1 and an end face 5 of an optical fiber arranging member 2 housing the optical fiber 3 are adhered via an adhesive 6 in such a manner that the optical waveguide 13 and the optical fiber 3 are optically coupled at the time of coupling these two end faces. The surface of the adhesive 6 is coated with an SiO2 film 7. As a result, the moisture in the outdoor air is shut off and physical and chemical stability is attained, and the adhesive 6 is protected. Therefore, the adhesion property is maintained over a long period of time and the characteristics at and under the high temp. and high humidity are greatly improved.


Inventors:
ISHIKAWA SHINJI
SUGANUMA HIROSHI
YUI MASARU
SAITO MASAHIDE
HIRAI SHIGERU
Application Number:
JP16925593A
Publication Date:
January 31, 1995
Filing Date:
July 08, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C09J11/00; C09J11/04; G02B6/30; (IPC1-7): G02B6/30; C09J11/00
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)



 
Next Patent: 防塵マスク