PURPOSE: To reduce thickness and connect a semiconductor device at fine pitch, by providing a wiring circuit on an insulative film, a semiconductor device which is connected with the wiring circuit by using insulative resin in which conductive particles are mixed, and sealing resin which covers the semiconductor device.

CONSTITUTION: After adhesive agent 17 is spread on an insulative film 11 in which tape feeding guide holes 15 are formed, a metal film is stuck on the insulative film 11. After the adhesive agent 17 is cured, dry film resist is stuck on the metal film. Then exposure and development are performed by using a photo mask, and the dry film resist is patterned. Further a wiring circuit 13 is formed. Insulative resin 19 in which conductive particles 21 are mixed is formed on the wiring circuit 13 on the insulative film 11, so as to have the same external shape as a semiconductor device 25. Then the semiconductor device 25 having a protruding electrode 27 is connected with the wiring circuit 13. After that, sealing resin 23 is formed so as to cover the semiconductor device 25.