Title:
PACKAGING STRUCTURE OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS62217621
Kind Code:
A
Abstract:
PURPOSE: To ensure the grounding of an IC chip, by electrically connecting grounding lead members of a film carrier and a substrate at the back surface of the IC chip.
CONSTITUTION: A conductive paste material 9 is provided at the edge part of a metal evaporated film 13, which is formed on a substrate at the back surface of a chip 11, along the side part of the IC chip 11, from grounding finger leads 15 and a bumps 17, which are bonded to the leads 15. Then the leads 15 and the evaporated film 13, which is formed on the substrate at the back surface of the chip 11, are electrically connected. Thus the grounding of the chip 11 is ensured.
Inventors:
IBA YUICHIRO
Application Number:
JP5927686A
Publication Date:
September 25, 1987
Filing Date:
March 19, 1986
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Yasuo Miyoshi